FitPC2 x86 BSP Project

2110-002-621
Add a Deos Board Support Package (BSP) for the Fit PC x86 platform.

Description

There is the need for a commercially available x86 bsp to aid our customers in evaluating our product and to begin prototyping. For this product we will be purchasing a quantity of these boards to use as customer loaner and demonstration vehicles. Marketing has chosen the “Fit-PC2 Diskless” as this supported demonstration and prototyping vehicle. This reference platform will require a port to the Intel Atom CPU, which looks to be a very promising CPU due to its integrated graphics, and lower power operation (see Fit-PC Price and Availability).

Note. This BSP does not need to be DO-178B verified.

This project requires the following expertise:

• Deos Platform Abstraction Layer (PAL)
• Deos Boot
• Low-level hardware and firmware skills

Status

Milestones	Due Date	Estimated Delivery	Delivered	Percentage Complete
[1] Board Executes Deos and Pings	30-SEP-09	TBD	TBD	59%

It is highly unlikely that the FitPC2 will make the 30-SEP-09 Bach deadline. Matt has boot code building (using our legacy cygwin environment) and running (boot transitions control to the Deos hyperstat image). Next step is the PAL.

[1] Board Executes Deos and Pings

Task	Dependency	Assignee	Original Estimate	Elapsed	Remaining
0.9 Build Infrastructure - I've set this to zero effort remaining assuming the desire to perform this BSP build within OpenArbor has been dropped in favor of getting the BSP binaries themselves shipped.	None	Matt	0	54	0
1.0 Implement Deos Boot	None	Matt	10	14	0
1.1 Implement Deos PAL	None	Matt	40	116	0
1.2 Implement LwIP Compatible Network Driver - For a pro1000 chipset, non-partitioned	None	Matt	160	65	95
1.25 Makeboot Updates	None	Matt	30	0	30
1.3 Design and User Documentation / Packaging	None	Matt	24	7	17
1.4 Acceptance and Stress Testing	None	Matt	40	4	36
Totals			304	260	178