User:Ccespedes@ddci.com

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  • Carlos Cespedes
  • Av Paseo Solares 999, Zapopan, Jalisco, Mexico, 45019
  • MX: +52 33 1462 1533
  • CR: +506 7224 5007
  • Work: TBD
  • mailto:ccespedes@ddci.com


General Information

Out of Office

  • 12/24 - 01/02: Holidays
  • 01/09: Flight back to GDL

Weekly Status

12/22/2025 - 12/23/2025

Summary:

  • NAI68int6 ported to modular boot with support to most recent pdata


Plan For Next Week:

  • On vacations 12/24 - 01/02.

Blocking Issues:

  • None


12/01/2025 - 12/05/2025

Summary:

  • Zhangmen
    1. Support cases
      • Sent instructions to test Configurable TDP using customer's HW
      • Sent alternative for SPI programming when ISP is not available
      • Initial investigation for IO configuration for 3.3V SPI
  • vek385 (tsunami release)
    1. Supported Adina with debugging boot. Board is booting with the new pdata definition:
      • Fixed errors in boot code
      • Updated pdata tool to support new definition
    2. Modular PAL (arm/aarch64):
      • Removed hard-coded timer interrupts. New PAL reads information from registry and determines the window, thread and spurious interrupt numbers from that data
      • Initial draft for using configWords from registry to configure interrupt level/sense

Plan For Next Week:

  • VEK385 (tsunami release)
    1. Complete code to use configwords for level/sense configuration
    2. Complete code to use configwords for aggregated interrupts
      • Port s32g2 to the new pdata
  • Zhangmen
    1. Support case. Continue investigation on 3.3V IO setting.
    2. Draft documentation for stage1a/b
  • Loewen
    1. Boot code reviews
      • On-hold until custom HW is properly farmed


Blocking Issues:

  • Zhangmen
    1. Bare metal debugging requires constant re-flashing of BIOS chip (i.e. farmer availability). Perhaps we should consider a Flash Emulator


11/10/2025 - 11/14/2025

Summary:

  • Loewen
    1. PAL SRD diff-reviews completed
  • Zhangmen
    1. Supported Will Harrigan with VT-d register dump on nai68int6 target
    2. bare-metal development


Plan For Next Week:

  • Attending GeekFest 2025
  • Zhangmen
    1. Draft documentation for stage1a/b


Blocking Issues:

  • Zhangmen
    1. Bare metal debugging requires constant re-flashing of BIOS chip (i.e. farmer availability). Perhaps we should consider a Flash Emulator


11/03/2025 - 11/07/2025

Summary:

  • GeekFest
    1. Prepared material for topic Intel's Firmware on Verified BSPs
  • Zhangmen
    1. bare-metal development
      • Confirmed current progress works for both available come-ctl boards


Plan For Next Week:

  • Zhangmen
    1. Continue bare-metal development
      • Complete Stage1A+B
  • Modular boot
    1. Support Adina with tooling and one-PAL to rule them all
  • Secure boot
    1. Support as needed
  • Loewen
    1. Boot code reviews (low priority)


Blocking Issues:

  • Zhangmen
    1. Bare metal debugging requires constant re-flashing of BIOS chip (i.e. farmer availability). Perhaps we should consider a Flash Emulator
    2. Bare metal development is getting to a point where access to HW is key. Available tgl boards are often under high-demand


10/27/2025 - 10/31/2025

Summary:

  • Loewen
    1. Supported analysis of abc coverage report for PAL
  • vek385
    1. Minor updates to provisioning data tool. 1.1.0-2 unreleased
  • Zhangmen
    1. Successfully loaded/executed custom loader in target
      • Still with many bloatware. This is just to set a starting point with Kismet environment


Plan For Next Week:

  • GeekFest
    1. Prepare material for topic Verifcation of intel BSP
  • vek385
    1. Support Adina with one-PAL to rule them all dev
  • Zhangmen
    1. Continue bare-metal development
      • Complete Stage1A+B (Stage2 if time allows)
  • Secure boot
    1. Support as needed
  • Loewen
    1. Boot code reviews (low priority)


Blocking Issues:

  • Zhangmen
    1. It was confirmed by Kontron that in-system programming is not available for our boards
      • Bare metal debugging requires constant re-flashing of BIOS chip (i.e. farmer availability). Perhaps we should consider a Flash Emulator
    2. Bare metal development is getting to a point where access to HW is key. Available tgl boards are often under high-demand


10/20/2025 - 10/24/2025

Summary:

  • Supported Jared
  • Supported modular boot for versal-edge2
    1. Completed updates for single boot entry in vek385 provisioning data
  • Zhangmen
    1. Ported Slimbootloader to build in Kismet
    2. Started integration of Stage 1B - Memory Init


Plan For Next Week:

  • Zhangmen
    1. Continue bare-metal development
      • Stitch FSP-M firmware with image
      • Try on HW
  • Secure boot
    1. Support as needed
  • Loewen
    1. Continue Boot code reviews (low priority)
    2. Support analysis of abc coverage report


Blocking Issues:

  • Zhangmen
    1. Bare metal development is getting to a point where access to HW is key. Available tgl boards are often under high-demand
    2. Bare metal debugging requires constant re-flashing of BIOS chip (i.e. farmer availability). Perhaps we should consider a Flash Emulator


10/13/2025 - 10/17/2025

Summary:

  • Loewen
    1. Boot/PAL diff-reviews completed
    2. Started Boot code reviews
  • Modular boot
    1. Major updates to pdata tooling completed


Plan For Next Week:

  • Zhangmen
    1. Continue bare-metal development
      • Stitch FSP-T firmware with image
      • Try on HW
  • Secure boot
    1. Support as needed
  • Modular boot
    1. Updates to versal-edge2 BSP
  • Loewen
    1. Continue Boot code reviews
    2. Support analysis of abc coverage report


Blocking Issues:

  • None


10/06/2025 - 10/10/2025

Summary:

  • Modular boot
    1. Fixed issue identified by OA Testing
    2. Additional updates to pdata tooling to support changes in pdata definition
  • Secure boot
    1. Completed driver UG and SRD
      • Enabled srd to code traces


Plan For Next Week:

  • Loewen
    1. PAL diff-reviews
    2. Boot code reviews
    3. Support analysis of abc coverage report
  • Secure boot
    1. Support as needed
  • Modular boot
    1. Complete updates to pdata tooling
  • Zhangmen
    1. Continue bare-metal development
      • Stitch FSP-T firmware with image
      • Try on HW


Blocking Issues:

  • None



09/29/2025 - 10/03/2025

Summary:

  • Modular boot
    • Updated pdata tooling to support changes in pdata definition
  • Secure boot
    • Updated Driver UG and SRD
      • Pending 1 function
    • Support as needed
  • Zhangmen
    • Initial assessment on request to modify bios settings during execution


Plan For Next Week:

  • Loewen
    • Boot code reviews
  • Secure boot
    • Complete driver docs
    • Support as needed
  • Modular boot
    • Test on targets
  • Zhangmen
    • Continue bare-metal development
      • Stitch FSP-T firmware with image
      • Try on HW


Blocking Issues:

  • None



09/22/2025 - 09/26/2025

Summary:

  • Zhangmen
    • Continued understanding slimboot
    • Drafted boot stage1 component. Pending:
      • Stitch FSP-T firmware with image
      • Try on HW


Plan For Next Week:

  • Zhangmen
    • Stitch FSP firmware with boot image
  • Secure boot
    • Try ptp-fifo driver in an ARM board
    • Write documentation for ptp-fifo driver
    • Support as needed
  • Modular boot
    • Updates to pdata tooling driven by new BSPs development


Blocking Issues:

  • None


09/15/2025 - 09/19/2025

Summary:

  • Secure boot
    • Updated base64 for proper integration with crypto lib


  • Zhangmen
    • Studied UEFI PI Spec
      • Started 'porting' python tools for FD, FV, FFS manipulation required for FSP integration
    • Continued with Intel FSP (Firmware Support Package) understanding
    • Continued with TigerLake Intel FSP Integration Guide understanding
    • Continued with understanding of slimboot first stage bootloader phase
      • 16-bits to 32-bits to FSP-T


Plan For Next Week:

  • Zhangmen
    • Complete understanding of slimboot first stage bootloader phase
      • Start drafting boot stage1 component
  • Secure boot
    • Try ptp-fifo driver in an ARM board
    • Support as needed
  • Modular boot
    • Updates to pdata tooling driven by new BSPs development


Blocking Issues:

  • None


09/08/2025 - 09/12/2025

Summary:

  • Secure boot
    • tcti-tis vfile driver
      • Agreed to rename driver to ptp-fifo (PTP is the spec for TPM2.0, which includes 2 different interfaces: FIFO (which also covers TIS from TPM1.2) and CRB (not implemented yet as part of our solution))
  • Zhangmen
    • Studied Intel FSP (Firmware Support Package) Spec which includes micro-code for basic cpu initialization
    • Studied TigerLake Intel FSP Integration Guide
    • Started looking into slimboot first bootloader stage which integrates FSP-T (-T for temp memory)
    • Checked old x86 bare-metal BSPs
  • Modular boot
    • Root caused identified issue with non modular BSPs


Plan For Next Week:

  • Zhangmen
    • Complete understanding of slimboot first stage bootloader phase
      • Start drafting boot component
  • Secure boot
    • Try ptp-fifo driver in an ARM board
    • Support as needed
  • Modular boot
    • Updates to pdata tooling driven by new BSPs development


Blocking Issues:

  • None


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